Vertically integrated image sensor chips and methods for forming the same
US9123615B2 · kind B2 · utility
7Cited by
0References
20Claims
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Assignee
Inventors
Key dates
| Filing date | May 19, 2014 |
| Grant date | Sep 1, 2015 |
| Priority date | — |
| Expiry date | May 19, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/805
Abstract
A method includes bonding a Backside Illumination (BSI) image sensor chip to a device chip, forming a first via in the BSI image sensor chip to connect to a first integrated circuit device in the BSI image sensor chip, forming a second via penetrating through the BSI image sensor chip to connect to a second integrated circuit device in the device chip, and forming a metal pad to connect the first via to the second via.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.