Die warpage control for thin die assembly
US9123732B2 · kind B2 · utility
1Cited by
0References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2012 |
| Grant date | Sep 1, 2015 |
| Priority date | — |
| Expiry date | Aug 3, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Die warpage is controlled for the assembly of thin dies. In one example, a device having a substrate on a back side and components in front side layers is formed. A backside layer is formed over the substrate, the layer resisting warpage of the device when the device is heated. The device is attached to a substrate by heating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.