Processing system for detecting in-situ arcing events during substrate processing
US9129779B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 6, 2012 |
| Grant date | Sep 8, 2015 |
| Priority date | — |
| Expiry date | Mar 26, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02H3/44
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A processing system for detecting in-situ arcing events during substrate processing is provided. The processing systems includes at least a plasma processing chamber having a probe arrangement, wherein the probe arrangement is disposed on a surface of the processing chamber and is configured to measure at least one plasma processing parameter. The probe arrangement includes a plasma-facing sensor and a measuring capacitor, wherein the plasma-facing sensor is coupled to a first plate of the measuring capacitor. The probe arrangement also includes a detection arrangement that is coupled to a second plate of the measuring capacitor, wherein the detection arrangement is configured for converting an induced current flowing through the measuring capacitor into a set of digital signals, which is processed to detect the in-situ arcing events.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.