Epoxy bump for overhang die
US9129826B2 · kind B2 · utility
4Cited by
9References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 30, 2006 |
| Grant date | Sep 8, 2015 |
| Priority date | — |
| Expiry date | Jun 21, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a semiconductor assembly having stacked elements, discrete bumps made of a polymer such as an electrically nonconductive epoxy are interposed between the upper surface of a substrate and the lower surface of the overhanging part of an elevated element (die or package) with the discrete bump directly under bond sites on the elevated element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.