3D integrated circuit package with window interposer

US9129958B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Debendra Mallik · Chandler, US
• Ram Viswanath · Phoenix, US
• Sriram Srinivasan · Sammamish, US
• Mark Bohr · Beaverton, US
• Andrew W. Yeoh · Portland, US
• Sairam Agraharam · Chandler, US

Key dates

• Filing date: Dec 22, 2011
• Grant date: Sep 8, 2015
• Expiry date: Dec 22, 2031

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/15311
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

3D integrated circuit packages with window interposers and methods to form such semiconductor packages are described. For example, a semiconductor package includes a substrate. A top semiconductor die is disposed above the substrate. An interposer having a window is disposed between and interconnected to the substrate and the top semiconductor die. A bottom semiconductor die is disposed in the window of the interposer and interconnected to the top semiconductor die. In another example, a semiconductor package includes a substrate. A top semiconductor die is disposed above the substrate. An interposer is disposed between and interconnected to the substrate and the top semiconductor die. A bottom semiconductor die is disposed in a same plane as the interposer and interconnected to the top semiconductor die.