Hybrid dicing process using a blade and laser
US9130057B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2014 |
| Grant date | Sep 8, 2015 |
| Priority date | — |
| Expiry date | Jun 30, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/54
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and system of hybrid dicing using a blade and laser are described. In one embodiment, a method involves focusing a laser beam inside the substrate in regions between the integrated circuits, inducing defects inside the substrate in the regions. The method also involves forming a groove on a surface of the substrate with a blade saw in the regions. The method further involves singulating the integrated circuits at the regions with the induced defects and the groove. In one embodiment, a system includes a laser module configured to focus a laser beam inside the substrate in regions between the integrated circuits, inducing defects inside the substrate in the regions. A blade grooving module is configured to form a groove in a surface of the substrate with a blade saw in the regions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.