Encapsulation of backside illumination photosensitive device

US9130080B2 · kind B2 · utility

Assignee

• Industrial Technology Research Institute · TW

Inventors

• Zhi-Cheng Hsiao · 埔鹽鄉, TW
• Ming-Ji Dai · Hsinchu, TW
• Cheng-Ta Ko · Taipei, TW

Key dates

• Filing date: Jul 17, 2013
• Grant date: Sep 8, 2015
• Expiry date: Sep 17, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10F39/8063

Abstract

An encapsulation of backside illumination photosensitive device including a circuit sub-mount, a backside illumination photosensitive device, a plurality of conductive terminals, and a heat dissipation structure is provided. The backside illumination photosensitive device includes an interconnection layer and a photosensitive device array, wherein the interconnection layer is located on the circuit sub-mount, and between the photosensitive device array and the circuit sub-mount. The conductive terminals are located between the interconnection layer and the circuit sub-mount to electrically connect the interconnection layer and the circuit sub-mount. The heat dissipation structure is located under the interconnection layer, and the heat dissipation structure and the photosensitive device array are respectively located at two opposite sides of the interconnection layer.