Patent · US Active

Stacked die sensor package

US9134193B2 · kind B2 · utility

0Cited by

16References

15Claims

0Family size

Assignee

Freeescale Semiconductor, Inc. · US

Inventors

Chee Seng Foong · Bandar Baru Sungai Buloh, MY
Lau Teck Beng · Kuala Lumpur, MY
Sheng Ping Took · Subang Jaya, MY

Key dates

Filing date	Dec 6, 2013
Grant date	Sep 15, 2015
Priority date	—
Expiry date	Feb 21, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A stacked die sensor package includes a die paddle and lead fingers that surround the die paddle. The lead fingers have proximal ends near the die paddle and distal ends spaced from the die paddle. A first semiconductor die is mounted to one side of the die paddle and electrically connected to the lead fingers with first bond wires. A sensor die is mounted to the other side of the die paddle and electrically connected to the lead fingers with sensor bond wires. An encapsulation material covers the first die and the first bond wires, while a gel material and a lid cover the sensor die and the sensor bond wires. The package may also have a second semiconductor die attached on an active surface of the first die and electrically connected one or both of the lead fingers or first die bonding pads with second bond wires.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.