Method and device for processing wafer shaped articles
US9136155B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 17, 2011 |
| Grant date | Sep 15, 2015 |
| Priority date | — |
| Expiry date | Jul 16, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49998
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and device for treating a wafer-shaped article utilizes a novel clamping mechanism, which permits wafer shift to be performed with reduced wear to the chuck pins. A wafer is rotated on a spin chuck that has a plurality of pins positioned at a periphery of the wafer shaped article. The pins each have a head portion which, in a service position, extends radially inwardly of and above the wafer. Gas is supplied onto a surface of the wafer facing the spin chuck at a flow rate sufficient to displace the wafer upwardly into contact with the head portions of the pins. This serves to clamp the wafer against the head portions of the pins. However, the pins contact the wafer only on upwardly oriented wafer surfaces and the wafer is supported from below solely by the gas flow.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.