Method and system for a semiconductor for device package with a die-to-packaging substrate first bond
US9136159B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 15, 2012 |
| Grant date | Sep 15, 2015 |
| Priority date | — |
| Expiry date | Nov 15, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods and systems for a semiconductor device package with a die-to-packing substrate first bond are disclosed and may include bonding a first semiconductor die to a packaging substrate, applying an underfill material between the first semiconductor die and the packaging substrate, and bonding one or more additional die to the first semiconductor die. The additional die may comprise electronic devices. The first semiconductor die may comprise an interposer die or may comprise electronic devices. The first semiconductor die may be bonded to the packaging substrate utilizing a mass reflow process or a thermal compression process. The additional die may be bonded to the first die utilizing a mass reflow process or a thermal compression process. The bonded die may be encapsulated in a mold material, which may comprise a polymer. The one or more additional die may comprise micro-bumps for coupling to the first semiconductor die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.