Deionized water conditioning system and methods
US9138784B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 6, 2010 |
| Grant date | Sep 22, 2015 |
| Priority date | — |
| Expiry date | Jul 23, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67051
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
An apparatus for conditioning deionized water and delivering it to a semiconductor wafer in a post electrofill module includes a degassing station configured to remove dissolved gas from the deionized water flow, a heating station configured to heat the deionized water flow, and a nozzle configured to deliver the deionized water flow to the wafer. The heating and degassing are performed before the delivery of the deionized water flow to the wafer. In some implementations the degassing station includes a contact degasser or an inert gas bubbler, and the heating station is configured to heating the deionized water flow to a temperature of between about 35-40° C. In some embodiments the deionized water flow is passed through the degassing station before being passed through the heating station.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.