Inventor · Tualatin, OR, US

Bryan L. Buckalew

75Patents
14h-index
66Co-inventors
87Inventor score

Filing activity: May 20, 2003 → Jan 17, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US8308931B2 Method and apparatus for electroplating Electricity 60 Active
US7854828B2 Method and apparatus for electroplating including remotely positioned second cathode Chemistry; Metallurgy 48 Active
US7985325B2 Closed contact electroplating cup assembly Chemistry; Metallurgy 27 Active
US7935231B2 Rapidly cleanable electroplating cup assembly Chemistry; Metallurgy 26 Active
US8084339B2 Remote plasma processing of interface surfaces Electricity 24 Active
US8217513B2 Remote plasma processing of interface surfaces Electricity 23 Active
US8172992B2 Wafer electroplating apparatus for reducing edge defects Chemistry; Metallurgy 21 Active
US7727863B1 Sonic irradiation during wafer immersion Electricity 21 Active
US9449808B2 Apparatus for advanced packaging applications Electricity 20 Active
US8128791B1 Control of electrolyte composition in a copper electroplating apparatus Chemistry; Metallurgy 19 Active
US8377268B2 Electroplating cup assembly Chemistry; Metallurgy 18 Active
US8500983B2 Pulse sequence for plating on thin seed layers Chemistry; Metallurgy 17 Active
US8398831B2 Rapidly cleanable electroplating cup seal Chemistry; Metallurgy 17 Active
US9624592B2 Cross flow manifold for electroplating apparatus Electricity 17 Active
US8858774B2 Electroplating apparatus for tailored uniformity profile Electricity 14 Active
US9523155B2 Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating Chemistry; Metallurgy 14 Active
US9028666B2 Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath Electricity 13 Active
US9394620B2 Control of electrolyte hydrodynamics for efficient mass transfer during electroplating Chemistry; Metallurgy 13 Active
US9834852B2 Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating Chemistry; Metallurgy 13 Active
US9752248B2 Methods and apparatuses for dynamically tunable wafer-edge electroplating Chemistry; Metallurgy 13 Active
US9607822B2 Pretreatment method for photoresist wafer processing Electricity 11 Active
US9138784B1 Deionized water conditioning system and methods Electricity 11 Active
US9899230B2 Apparatus for advanced packaging applications Electricity 10 Active
US6884335B2 Electroplating using DC current interruption and variable rotation rate Emerging Cross-Sectional Technologies 10 Expired
US10094034B2 Edge flow element for electroplating apparatus Chemistry; Metallurgy 10 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.