Patent · US Active

Smart card module for a smart card

US9141902B2 · kind B2 · utility

0Cited by

5References

11Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Frank Pueschner · Kelheim, DE
Kristof Bothe · Regensburg, DE
Juergen Hoegerl · Regensburg, DE
Andreas Karl · Marbach am Neckar, DE
Andreas Mueller-Hipper · Regensburg, DE
Peter Scherl · Regensburg, DE
Peter Stampka · Burglengenfeld, DE
Uwe Wagner · Volketswil, CH

Key dates

Filing date	Sep 29, 2012
Grant date	Sep 22, 2015
Priority date	—
Expiry date	May 30, 2033

Classification

Technology area (CPC G)Physics
CPC primaryG06K19/07747
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

A smart card module for a smart card, comprising a chip having electrical contacts at a front side; a first laminate layer, wherein a rear side of the chip is connected to the first laminate layer, the rear side of the chip opposite the front side; a second laminate layer; a first conductive layer, wherein the electrical contacts of the chip are connected to the first conductive layer and the first conductive layer is arranged between the chip and the second laminate layer; and an adhesive material arranged between the chip and the conductive layer and/or the second laminate layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.