Polishing apparatus and polishing method
US9144881B2 · kind B2 · utility
3Cited by
13References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 24, 2014 |
| Grant date | Sep 29, 2015 |
| Priority date | — |
| Expiry date | Feb 24, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67219
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A polishing apparatus includes a peripheral-portion polishing unit configured to polish a peripheral portion of the substrate, a CMP unit configured to polish a flat surface of the substrate W, a cleaning unit configured to clean the polished substrate, a transport system configured to transport the substrate. The transport system transports the substrate that has been polished in one of the peripheral-portion polishing unit and the CMP unit to the cleaning unit, and transports the substrate that has been cleaned in the cleaning unit to the other of the peripheral-portion polishing unit and the CMP unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.