Maintaining a wafer/wafer translator pair in an attached state free of a gasket diposed
US9146269B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 17, 2013 |
| Grant date | Sep 29, 2015 |
| Priority date | — |
| Expiry date | Jan 17, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2886
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A wafer translator and a wafer, removably attached to each other, provides the electrical connection to electrical contacts on integrated circuits on a wafer in such a manner that the electrical contacts are substantially undamaged in the process of making such electrical connections. Various embodiments of the present invention provide a gasketless sealing means for facilitating the formation by vacuum attachment of the wafer/wafer translator pair. In this way, no gasket is required to be disposed between the wafer and the wafer translator. Air, or gas, is evacuated from between the wafer and wafer translator through one or more evacuation pathways in the gasketless sealing means.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.