Apparatus for liquid treatment of wafer shaped articles
US9147593B2 · kind B2 · utility
3Cited by
9References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 10, 2012 |
| Grant date | Sep 29, 2015 |
| Priority date | — |
| Expiry date | Mar 28, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/3493
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Apparatus for processing wafer-shaped articles comprises a chuck adapted to hold a wafer-shaped article of a predetermined diameter during a processing operation to be performed on the wafer-shaped article. The chuck comprises a chuck body having an outer surface that faces a wafer-shaped article when positioned on the chuck. The outer surface comprises a first electrically conductive material and the chuck body further comprises a first conductive pathway between the first conductive material and ground.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.