Patent · US Active

Monitor structures and methods of formation thereof

US9147610B2 · kind B2 · utility

2Cited by

6References

15Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Albert Birner · Regensburg, DE
Tobias Herzig · Regensburg, DE

Key dates

Filing date	Jun 22, 2012
Grant date	Sep 29, 2015
Priority date	—
Expiry date	Apr 5, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

In accordance with an embodiment of the present invention, a method of forming an electronic device includes forming a first opening and a second opening in a workpiece. The first opening is deeper than the second opening. The method further includes forming a fill material within the first opening to form part of a through via and forming the fill material within the second opening.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.