Albert Birner
63Patents
8h-index
43Co-inventors
78Inventor score
Filing activity: May 31, 2001 → Jan 5, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7081384B2 | Method of forming a silicon dioxide layer | Emerging Cross-Sectional Technologies | 51 | Expired |
| US7772123B2 | Through substrate via semiconductor components | Electricity | 29 | Active |
| US6559069B2 | Process for the electrochemical oxidation of a semiconductor substrate | Electricity | 25 | Expired |
| US8399936B2 | Through substrate via semiconductor components | Electricity | 20 | Active |
| US8227340B2 | Method for producing a copper connection between two sides of a substrate | Electricity | 15 | Active |
| US7192830B2 | Method for fabricating a memory cell | Electricity | 11 | Expired |
| US6919255B2 | Semiconductor trench structure | Electricity | 10 | Expired |
| US9997443B2 | Through vias and methods of formation thereof | Electricity | 9 | Active |
| US6660582B2 | Method of forming a vertical field-effect transistor device | Electricity | 6 | Expired |
| US7268381B2 | Memory cell with trench capacitor and vertical select transistor and an annular contact-making region formed between them | Electricity | 6 | Expired |
| US6878600B2 | Method for fabricating trench capacitors and semiconductor device with trench capacitors | Electricity | 6 | Expired |
| US6861312B2 | Method for fabricating a trench structure | Electricity | 5 | Expired |
| US6863769B2 | Configuration and method for making contact with the back surface of a semiconductor substrate | Electricity | 5 | Expired |
| US7157371B2 | Barrier layer and a method for suppressing diffusion processes during the production of semiconductor devices | Electricity | 5 | Expired |
| US9991373B1 | Semiconductor device | Electricity | 4 | Active |
| US7084043B2 | Method for forming an SOI substrate, vertical transistor and memory cell with vertical transistor | Electricity | 4 | Expired |
| US9543260B2 | Segmented bond pads and methods of fabrication thereof | Electricity | 4 | Active |
| US9929107B1 | Method for manufacturing a semiconductor device | Electricity | 4 | Active |
| US8035140B2 | Method and layout of semiconductor device with reduced parasitics | Electricity | 3 | Active |
| US9147610B2 | Monitor structures and methods of formation thereof | Electricity | 2 | Active |
| US8815743B2 | Through substrate via semiconductor components and methods of formation thereof | Electricity | 2 | Active |
| US10431504B2 | Method of manufacturing semiconductor devices by bonding a semiconductor disk on a base substrate, composite wafer and semiconductor device | Electricity | 2 | Active |
| US10622284B2 | LDMOS transistor and method | Electricity | 2 | Active |
| US9530720B2 | Monitor structures and methods of formation thereof | Electricity | 1 | Active |
| US7385256B2 | Transistor arrangement in monocrystalline substrate having stress exerting insulators | Electricity | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.