Patent · US Active

Module including a discrete device mounted on a DCB substrate

US9147637B2 · kind B2 · utility

3Cited by

8References

12Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Ralf Otremba · Kaufbeuren, DE
Roland Rupp · Achern, DE
Daniel Domes · Schwäbisch Hall, DE

Key dates

Filing date	Dec 23, 2011
Grant date	Sep 29, 2015
Priority date	—
Expiry date	Oct 18, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19105
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A module includes a DCB substrate and a discrete device mounted on the DCB substrate, wherein the discrete device comprises a leadframe, a semiconductor chip mounted on the leadframe and an encapsulation material covering the semiconductor chip.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.