Process for fabricating a transistor comprising nanoscale semiconductor features using block copolymers
US9147750B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 25, 2013 |
| Grant date | Sep 29, 2015 |
| Priority date | — |
| Expiry date | May 25, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/017
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process for fabricating one transistor, comprising a semiconductor region, comprising a source region, a drain region, and a channel region covered with a gate, comprises: production of an primary etching mask on the surface of the semiconductor region, said mask containing at least one primary aperture; depositing in said primary aperture a block copolymer containing, in alternation, at least first polymer domains and second polymer domains; removing either a series of first polymer domains or a series of second polymer domains in order to create a secondary mask containing secondary apertures; etching said active region through said secondary apertures in order to define nanoscale self-aligned semiconductor features; producing said gate on the surface of said self-aligned semiconductor features.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.