Francois Andrieu
29Patents
2h-index
39Co-inventors
57Inventor score
Filing activity: May 13, 1991 → Jul 21, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5140289A | Combined microwave and optic rotary joint | Physics | 26 | Expired |
| US9520330B2 | Integrated circuit comprising PMOS transistors with different voltage thresholds | Electricity | 3 | Active |
| US9214515B2 | Method for making a semiconductor structure with a buried ground plane | Electricity | 1 | Active |
| US8809964B2 | Method of adjusting the threshold voltage of a transistor by a buried trapping layer | Electricity | 1 | Active |
| US9558957B2 | Method for manufacturing a substrate provided with different active areas and with planar and three-dimensional transistors | Electricity | 1 | Active |
| US8853023B2 | Method for stressing a thin pattern and transistor fabrication method incorporating said method | Electricity | 1 | Active |
| US10263110B2 | Method of forming strained MOS transistors | Electricity | 1 | Active |
| US7820523B2 | Fabrication of active areas of different natures directly onto an insulator: application to the single or double gate MOS transistor | Emerging Cross-Sectional Technologies | 1 | Active |
| US9985029B2 | Integrated circuit with NMOS and PMOS transistors having different threshold voltages through channel doping and gate material work function schemes | Electricity | 1 | Active |
| US10418486B2 | Integrated circuit chip with strained NMOS and PMOS transistors | Electricity | 0 | Active |
| US10504897B2 | Integrated circuit comprising balanced cells at the active | Electricity | 0 | Active |
| US11810789B2 | Method of fabricating a semiconductor substrate having a stressed semiconductor region | Electricity | 0 | Active |
| US9514996B2 | Process for fabricating SOI transistors for an increased integration density | Electricity | 0 | Active |
| US9876032B2 | Method of manufacturing a device with MOS transistors | Electricity | 0 | Active |
| US11139209B2 | 3D circuit provided with mesa isolation for the ground plane zone | Electricity | 0 | Active |
| US8501588B2 | Method for making a semiconductor structure with a buried ground plane | Electricity | 0 | Active |
| US10651202B2 | 3D circuit transistors with flipped gate | Electricity | 0 | Active |
| US11653506B2 | Resistive 3D memory | Electricity | 0 | Active |
| US11889704B2 | Device comprising wrap-gate transistors and method of manufacturing such a device | Electricity | 0 | Active |
| US11024544B2 | Assembly for 3D circuit with superposed transistor levels | Electricity | 0 | Active |
| US10446548B2 | Integrated circuit including balanced cells limiting an active area | Electricity | 0 | Active |
| US10777680B2 | Integrated circuit chip with strained NMOS and PMOS transistors | Electricity | 0 | Active |
| US11888007B2 | Image sensor formed in sequential 3D technology | Electricity | 0 | Active |
| US11532670B2 | 3D memory and manufacturing process | Electricity | 0 | Active |
| US11011425B2 | Production of a 3D circuit with upper level transistor provided with a gate dielectric derived from a substrate transfer | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.