Through-substrate via (TSV) testing
US9157960B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 2, 2012 |
| Grant date | Oct 13, 2015 |
| Priority date | — |
| Expiry date | Sep 17, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Various embodiments comprise apparatuses and methods for testing and repairing through-substrate vias in a stack of interconnected dice. In various embodiments, an apparatus is provided that includes a number of through-substrate vias to couple to one or more devices, at least one redundant through-substrate via to allow a repair of the apparatus, and a pair of pull-up devices coupled to the through-substrate vias and the redundant through-substrate via to provide a high-data value to the first end of the respective through-substrate vias. A test register is coupled the second end of each of the through-substrate vias and the redundant through-substrate via to store a received version of the high-data value. A comparator compares the high-data value with the received version of the high-data value to test the through-substrate vias for short-circuit connections.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.