Apparatus for chemically etching a workpiece
US9159599B2 · kind B2 · utility
1Cited by
7References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 12, 2010 |
| Grant date | Oct 13, 2015 |
| Priority date | — |
| Expiry date | Sep 16, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3299
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Apparatus for chemically etching a workpiece includes a chamber for receiving a process gas and having a pumping port for extracting exhaust gases, and a workpiece support located in the chamber upstream of the pumping port. The chamber further includes a sub-chamber located upstream of the pumping port and downstream of the workpiece support, and the sub-chamber includes a window and an excitation source, adjacent the window, for creating a plasma in a sample of the exhaust gases to create an optical emission which can be monitored through the window.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.