Patent · US Active

Nanotube structure based metal damascene process

US9159669B2 · kind B2 · utility

0Cited by
1References
7Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 30, 2014
Grant dateOct 13, 2015
Priority date
Expiry dateJan 30, 2034

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/0002
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

In various embodiments a method for manufacturing a metallization layer on a substrate is provided, wherein the method may include forming a plurality of groups of nanotubes over a substrate, wherein the groups of nanotubes may be arranged such that a portion of the substrate is exposed and forming metal over the exposed portion of the substrate between the plurality of groups of nanotubes.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.