Semiconductor device and manufacturing method thereof
US9159678B2 · kind B2 · utility
35Cited by
2References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 18, 2013 |
| Grant date | Oct 13, 2015 |
| Priority date | — |
| Expiry date | Jan 16, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18162
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a die, a conductive post disposed adjacent to the die, and a molding surrounding the conductive post and the die, the molding includes a protruded portion protruded from a sidewall of the conductive post and disposed on a top surface of the conductive post. Further, a method of manufacturing a semiconductor device includes disposing a die, disposing a conductive post adjacent to the die, disposing a molding over the conductive post and the die, removing some portions of the molding from a top of the molding, and forming a recess of the molding above a top surface of the conductive post.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.