Post-deposition soft annealing
US9165788B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 5, 2013 |
| Grant date | Oct 20, 2015 |
| Priority date | — |
| Expiry date | Apr 5, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B43/27
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The methods and apparatus disclosed herein concern a process that may be referred to as a “soft anneal.” A soft anneal provides various benefits. Fundamentally, it reduces the internal stress in one or more silicon layers of a work piece. Typically, though not necessarily, the internal stress is a compressive stress. A particularly beneficial application of a soft anneal is in reduction of internal stress in a stack containing two or more layers of silicon. Often, the internal stress of a layer or group of layers in a stack is manifest as wafer bow. The soft anneal process can be used to reduce compressive bow in stacks containing silicon. The soft anneal process may be performed without causing the silicon in the stack to become activated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.