Keith Fox
20Patents
9h-index
36Co-inventors
75Inventor score
Filing activity: May 18, 2004 → Jul 13, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8591659B1 | Plasma clean method for deposition chamber | Electricity | 518 | Active |
| US7622400B1 | Method for improving mechanical properties of low dielectric constant materials | Electricity | 32 | Expired |
| US8124522B1 | Reducing UV and dielectric diffusion barrier interaction through the modulation of optical properties | Electricity | 26 | Active |
| US8173537B1 | Methods for reducing UV and dielectric diffusion barrier interaction | Electricity | 25 | Active |
| US8709551B2 | Smooth silicon-containing films | Electricity | 21 | Active |
| US7695765B1 | Methods for producing low-stress carbon-doped oxide films with improved integration properties | Electricity | 18 | Active |
| US8741394B2 | In-situ deposition of film stacks | Electricity | 15 | Active |
| US8563414B1 | Methods for forming conductive carbon films by PECVD | Chemistry; Metallurgy | 13 | Active |
| US8895415B1 | Tensile stressed doped amorphous silicon | Electricity | 10 | Active |
| US9028924B2 | In-situ deposition of film stacks | Electricity | 6 | Active |
| US9117668B2 | PECVD deposition of smooth silicon films | Electricity | 5 | Active |
| US10214816B2 | PECVD apparatus for in-situ deposition of film stacks | Electricity | 4 | Active |
| US9165788B2 | Post-deposition soft annealing | Electricity | 4 | Active |
| US11278141B2 | Garment and hood hanger | Human Necessities | 1 | Active |
| US11746420B2 | PECVD apparatus for in-situ deposition of film stacks | Electricity | 1 | Active |
| US10358717B2 | Method for depositing high deposition rate, thick tetraethyl orthosilicate film with low compressive stress, high film stability and low shrinkage | Electricity | 0 | Active |
| US12385138B2 | Plasma-enhanced deposition of film stacks | Electricity | 0 | Active |
| US10161034B2 | Rapid chamber clean using concurrent in-situ and remote plasma sources | Electricity | 0 | Active |
| US12341002B2 | Low stress films for advanced semiconductor applications | Electricity | 0 | Active |
| US9388491B2 | Method for deposition of conformal films with catalysis assisted low temperature CVD | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.