Sensor packaging method and sensor packages
US9165886B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 9, 2014 |
| Grant date | Oct 20, 2015 |
| Priority date | — |
| Expiry date | Jan 9, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1461
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method (80) entails providing (82) a structure (117), providing (100) a controller element (102, 24), and bonding (116) the controller element to an outer surface (52, 64) of the structure. The structure includes a sensor wafer (92) and a cap wafer (94) Inner surfaces (34, 36) of the wafers (92, 94) are coupled together, with sensors (30) interposed between the wafers. One wafer (94, 92) includes a substrate portion (40, 76) with bond pads (42) formed on its inner surface (34, 36). The other wafer (94, 92) conceals the substrate portion (40, 76). After bonding, methodology (80) entails forming (120) conductive elements (60) on the element (102, 24), removing (126) material sections (96, 98, 107) from the wafers to expose the bond pads, forming (130) electrical interconnects (56), applying (134) packaging material (64), and singulating (138) to produce sensor packages (20, 70).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.