Patent · US Active

Method for separating a plurality of dies and a processing device for separating a plurality of dies

US9165895B2 · kind B2 · utility

1Cited by

1References

19Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Helmut Brunner · Leonberg, DE
Manfred Engelhardt · Feldkirchen-Westerham, DE

Key dates

Filing date	Nov 7, 2011
Grant date	Oct 20, 2015
Priority date	—
Expiry date	Mar 13, 2033

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for separating a plurality of dies is provided. The method may include: selectively removing one or more portions from a carrier including a plurality of dies, for separating the plurality of dies along the selectively removed one or more portions, wherein the one or more portions are located between the dies; and subsequently forming over a back side of the dies, at least one metallization layer for packaging the dies

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.