Methods for fabricating integrated circuits including generating photomasks for directed self-assembly
US9170501B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 8, 2013 |
| Grant date | Oct 27, 2015 |
| Priority date | — |
| Expiry date | Aug 20, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F1/36
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Methods for fabricating integrated circuits are provided. In one example, a method for fabricating an integrated circuit includes generating a photomask for forming a DSA directing pattern on a semiconductor substrate. The DSA directing pattern is configured to guide a self-assembly material deposited thereon that undergoes directed self-assembly (DSA) to form a DSA pattern. Generating the photomask includes using a computing system, inputting a DSA target pattern and an initial pattern. An output mask writer pattern is produced from the initial pattern using the computing system, the DSA target pattern, a DSA model, an OPC model, and a MPC model. The output mask writer pattern is for a mask writer to write on the photomask.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.