Encapsulated sensors

US9171971B2 · kind B2 · utility

Assignee

• GLOBALFOUNDRIES U.S. 2 LLC · US

Inventors

• John J. Ellis-Monaghan · Grand Isle, US
• Jeffrey P. Gambino · Gresham, US
• Mark D. Jaffe · Shelburne, US
• William J. Murphy · North Ferrisburgh, US
• Kirk D. Peterson · Jericho, US
• Steven M. Shank · Jericho, US

Key dates

• Filing date: Oct 31, 2013
• Grant date: Oct 27, 2015
• Expiry date: Jan 20, 2034

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P70/50

Abstract

An encapsulated sensors and methods of manufacture are disclosed herein. The method includes forming an amorphous or polycrystalline material in contact with a layer of seed material. The method further includes forming an expansion space for the amorphous or polycrystalline material. The method further includes forming an encapsulation structure about the amorphous or polycrystalline material. The method further includes crystallizing the amorphous or polycrystalline material by a thermal anneal process such that the amorphous or polycrystalline material expands within the expansion space.