Combinatorial tool for mechanically-assisted surface polishing and cleaning
US9174323B2 · kind B2 · utility
2Cited by
6References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 7, 2012 |
| Grant date | Nov 3, 2015 |
| Priority date | — |
| Expiry date | Sep 9, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/10
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Polishing and cleaning techniques are combinatorially processed and evaluated. A polishing system can include a reactor assembly having multiple reaction chambers, with at least a reaction chamber including a rotatable polishing head, slurry and chemical distribution, chemical and water rinse, and slurry and fluid removal. Different downward forces can be applied to the polishing heads for evaluating optimum process conditions. Channels in the polishing pads can redistribute slurry and chemical to the polishing area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.