MN doped SN-base solder alloy and solder joints thereof with superior drop shock reliability
US9175368B2 · kind B2 · utility
1Cited by
1References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 5, 2012 |
| Grant date | Nov 3, 2015 |
| Priority date | — |
| Expiry date | Jul 5, 2032 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC22C13/02
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A Sn—Ag—Cu-based lead-free solder alloy and solder joints thereof with superior drop shock reliability are disclosed. The solder contains between greater than 0 wt. % and less than or equal to about 1.5 wt. % Ag; between greater than or equal to about 0.7 wt. % and less than or equal to about 2.0 wt. % Cu; between greater than or equal to about 0.001 and less than or equal to about 0,2 wt. % Mn; and a remainder of Sn.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.