Systems and methods for fabricating semiconductor device structures
US9177873B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 29, 2013 |
| Grant date | Nov 3, 2015 |
| Priority date | — |
| Expiry date | Jul 29, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/12
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods and systems are provided for fabricating and measuring physical features of a semiconductor device structure. An exemplary method of fabricating a semiconductor device structure involves obtaining raw measurement data for a wafer of semiconductor material from a metrology tool and adjusting a measurement model utilized by a metrology tool based at least in part on the raw measurement data and a value for a design parameter. The wafer has that value for the design parameter and an attribute of the semiconductor device structure fabricated thereon, wherein the measurement model is utilized by the metrology tool to convert the raw measurement data to a measurement value for the attribute.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.