Grooved CMP pad
US9180570B2 · kind B2 · utility
11Cited by
136References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 16, 2009 |
| Grant date | Nov 10, 2015 |
| Priority date | — |
| Expiry date | Jun 17, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/26
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
CMP pads having novel groove configurations are described. For example, described herein are CMP pads comprising primary grooves, secondary grooves, a groove pattern center, and an optional terminal groove. The CMP pads may be made from polyurethane or poly (urethane-urea), and the grooves produced therein may be made by a method from the group consisting of molding, laser writing, water jet cutting, 3-D printing, thermoforming, vacuum forming, micro-contact printing, hot stamping, and mixtures thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.