Stationary actively-cooled shadow ring for heat dissipation in plasma chamber
US9196498B1 · kind B1 · utility
14Cited by
54References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 12, 2014 |
| Grant date | Nov 24, 2015 |
| Priority date | — |
| Expiry date | Aug 12, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods of and apparatuses for dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a plasma processing apparatus includes a processing chamber having a chamber wall. The plasma processing apparatus also includes a plasma source in an upper portion of the processing chamber. A sample support is included for situating a sample below the plasma source. An actively-cooled shadow ring having a cooling channel therein for cooling fluid transport is fixedly attached to the chamber wall of the processing chamber, between the plasma source and the sample support.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.