Patent · US Active

Electronic component, arrangement and method

US9196554B2 · kind B2 · utility

2Cited by

11References

18Claims

0Family size

Assignee

Infineon Technologies Austria AG · AT

Inventors

Ralf Otremba · Kaufbeuren, DE
Josef Höglauer · Heimstetten, DE
Jürgen Schredl · Mering, DE
Xaver Schlögel · Sachsenkam, DE
Klaus Schiess · Allensbach, DE

Key dates

Filing date	Oct 1, 2013
Grant date	Nov 24, 2015
Priority date	—
Expiry date	Oct 1, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/09845
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An electronic component includes at least one semiconductor device and a redistribution board comprising at least two nonconductive layers and a conductive redistribution structure. The semiconductor device is embedded in the redistribution board and electrically coupled to the redistribution structure and the redistribution board has a side face with a step. An outer contact pad of the redistribution structure is arranged on the step.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.