Semiconductor package with air pressure sensor
US9200973B2 · kind B2 · utility
4Cited by
3References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2012 |
| Grant date | Dec 1, 2015 |
| Priority date | — |
| Expiry date | Dec 1, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D48/50
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor package having an air pressure sensor and methods to form a semiconductor package having an air pressure sensor are described. For example, a semiconductor package includes a plurality of build-up layers. A cavity is disposed in one or more of the build-up layers. An air pressure sensor is disposed in the plurality of build-up layers and includes the cavity and an electrode disposed above the cavity. Also described are various approaches to fabricating a semiconductor package having a hermetically sealed region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.