Quality of service support using stacked memory device with logic die
US9201777B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2012 |
| Grant date | Dec 1, 2015 |
| Priority date | — |
| Expiry date | Jun 19, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A die-stacked memory device implements an integrated QoS manager to provide centralized QoS functionality in furtherance of one or more specified QoS objectives for the sharing of the memory resources by other components of the processing system. The die-stacked memory device includes a set of one or more stacked memory dies and one or more logic dies. The logic dies implement hardware logic for a memory controller and the QoS manager. The memory controller is coupleable to one or more devices external to the set of one or more stacked memory dies and operates to service memory access requests from the one or more external devices. The QoS manager comprises logic to perform operations in furtherance of one or more QoS objectives, which may be specified by a user, by an operating system, hypervisor, job management software, or other application being executed, or specified via hardcoded logic or firmware.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.