Non-homogeneous molding of packaged semiconductor devices
US9202770B1 · kind B1 · utility
3Cited by
7References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 1, 2014 |
| Grant date | Dec 1, 2015 |
| Priority date | — |
| Expiry date | Sep 1, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48227
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A packaged semiconductor device has an integrated circuit (IC) die and first and second volumes of molding compound. The first volume of molding compound is disposed on a first portion of a first side of the IC die and comprises a first molding compound. The second volume of molding compound is disposed on a second side of the IC die, different from the first side, and comprises a second molding compound, different from the first molding compound. By including different molding compounds, the properties of the packaged semiconductor device can be varied across the device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.