Patent · US Active

Integrated IC package

US9204543B2 · kind B2 · utility

3Cited by

8References

21Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventor

Peter Ossimitz · Munich, DE

Key dates

Filing date	Dec 3, 2013
Grant date	Dec 1, 2015
Priority date	—
Expiry date	Feb 17, 2034

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49147
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

An Integrated Circuit (IC) package comprises a package comprising a first set of pads having a pinout that is compatible with a chip core of a product family. A second set of pads are on substantially the same plane as the first set of pads and outside the package core. The second set of pads is configured to accommodate a circuit outside the chip core. The geometric center of the package core is different from the geometric center of the IC package.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.