Semiconductor device assembled using two lead frames
US9209119B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 26, 2014 |
| Grant date | Dec 8, 2015 |
| Priority date | — |
| Expiry date | Nov 26, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A packaged semiconductor device is assembled using a first lead frame upon which a die is mounted and encapsulated and a second lead frame that provides bent leads for the device. By using two different lead frames, an array of the first lead frames can be configured with more lead frames for more devices than a comparably sized lead frame array of the prior art because the first lead frame array does not need to provide the leads for the packaged devices. Instead, the leads are provided by the second lead frame array, which can be attached to the first lead frame array after the dies have been mounted and encapsulated on the first lead frame array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.