Method for depinning the fermi level of a semiconductor at an electrical junction and devices incorporating such junctions
US9209261B2 · kind B2 · utility
20Cited by
59References
30Claims
0Family size
Assignee
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Key dates
| Filing date | Jun 18, 2015 |
| Grant date | Dec 8, 2015 |
| Priority date | — |
| Expiry date | Jun 18, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/62
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrical device in which an interface layer is disposed in between and in contact with a conductor and a semiconductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.