Semiconductor die package with pre-molded die
US9214413B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 23, 2014 |
| Grant date | Dec 15, 2015 |
| Priority date | — |
| Expiry date | Nov 23, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73265
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor die is packaged by providing a die assembly that includes a semiconductor die with an active surface and an opposite mounting surface with an attached thermally conductive substrate. The die assembly is mounted on a first surface of a lead frame die flag so that the thermally conductive substrate is sandwiched between the die flag and the semiconductor die. Bonding pads of the die are electrically connected with bond wires to lead frame lead fingers. A mold compound then encapsulates the semiconductor die, bond wires, and thermally conductive substrate. A second surface of the die flag is exposed through the mold compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.