Method for making a semiconductor structure with a buried ground plane
US9214515B2 · kind B2 · utility
1Cited by
3References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 10, 2013 |
| Grant date | Dec 15, 2015 |
| Priority date | — |
| Expiry date | Aug 12, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76254
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a method for making a semiconducting structure, including:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.