Yannick Le Tiec
22Patents
3h-index
16Co-inventors
52Inventor score
Filing activity: Aug 13, 2009 → Dec 4, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9105691B2 | Contact isolation scheme for thin buried oxide substrate devices | Electricity | 9 | Active |
| US9570465B2 | Dual STI integrated circuit including FDSOI transistors and method for manufacturing the same | Electricity | 6 | Active |
| US9601511B2 | Low leakage dual STI integrated circuit including FDSOI transistors | Electricity | 4 | Active |
| US8530331B2 | Process for assembling substrates with low-temperature heat treatments | Emerging Cross-Sectional Technologies | 2 | Active |
| US9337350B2 | Transistor with reduced parasitic capacitance and access resistance of the source and drain, and method of fabrication of the same | Electricity | 2 | Active |
| US9076732B2 | Method to prepare semi-conductor device comprising a selective etching of a silicium—germanium layer | Electricity | 1 | Active |
| US8969966B2 | Defective P-N junction for backgated fully depleted silicon on insulator MOSFET | Electricity | 1 | Active |
| US8987854B2 | Microelectronic device with isolation trenches extending under an active area | Electricity | 1 | Active |
| US9236478B2 | Method for manufacturing a fin MOS transistor | Electricity | 1 | Active |
| US9214515B2 | Method for making a semiconductor structure with a buried ground plane | Electricity | 1 | Active |
| US9437474B2 | Method for fabricating microelectronic devices with isolation trenches partially formed under active regions | Electricity | 0 | Active |
| US9070709B2 | Method for producing a field effect transistor with implantation through the spacers | Electricity | 0 | Active |
| US9373507B2 | Defective P-N junction for backgated fully depleted silicon on insulator mosfet | Electricity | 0 | Active |
| US9673329B2 | Method for manufacturing a fin MOS transistor | Electricity | 0 | Active |
| US9231062B2 | Method for treating the surface of a silicon substrate | Emerging Cross-Sectional Technologies | 0 | Active |
| US8501588B2 | Method for making a semiconductor structure with a buried ground plane | Electricity | 0 | Active |
| US8722499B2 | Method for fabricating a field effect device with weak junction capacitance | Electricity | 0 | Active |
| US8994142B2 | Field effect transistor with offset counter-electrode contact | Electricity | 0 | Active |
| US8877618B2 | Method for producing a field effect transistor with a SiGe channel by ion implantation | Electricity | 0 | Active |
| US9059041B2 | Dual channel hybrid semiconductor-on-insulator semiconductor devices | Electricity | 0 | Active |
| US9293474B2 | Dual channel hybrid semiconductor-on-insulator semiconductor devices | Electricity | 0 | Active |
| US8735259B2 | Method of producing insulation trenches in a semiconductor on insulator substrate | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.