Ball grid array configuration for reliable testing

US9217758B2 · kind B2 · utility

Assignee

• GlobalFoundries Inc. · KY

Inventors

• Otto A. Torreiter · Echterdingen, DE
• Dieter Wendel · Schenefeld, DE

Key dates

• Filing date: Jan 28, 2014
• Grant date: Dec 22, 2015
• Expiry date: Jan 28, 2034

Classification

• Technology area (CPC G): Physics
• CPC primary: G01R31/2601
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A method of testing a semiconductor die having an array of contacts, where at least two I/O pads in adjacent positions have the same data signal during testing operations with a test probe. The adjacent I/O pads form a test cluster allowing the use of a larger test probe tip and/or greater tolerance on test probe tip alignment during testing operations.