Patent · US Active

Separation of chips on a substrate

US9219011B2 · kind B2 · utility

2Cited by

4References

12Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Manfred Engelhardt · Feldkirchen-Westerham, DE
Gudrun Stranzl · Eisenlohrsweg, AT
Markus Zundel · Egmating, DE
Hubert Maier · Villach, AT

Key dates

Filing date	Aug 29, 2013
Grant date	Dec 22, 2015
Priority date	—
Expiry date	Oct 17, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2221/6834
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Various methods and apparatuses are provided relating to separation of a substrate into a plurality of parts. For example, first a partial separation is performed and then the partially separated substrate is completely separated into a plurality of parts.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.