Semiconductor device, wafer assembly and methods of manufacturing wafer assemblies and semiconductor devices
US9219020B2 · kind B2 · utility
3Cited by
5References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2012 |
| Grant date | Dec 22, 2015 |
| Priority date | — |
| Expiry date | Jun 21, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cavity is formed in a working surface of a substrate in which a semiconductor element is formed. A glass piece formed from a glass material is bonded to the substrate, and the cavity is filled with the glass material. For example, a pre-patterned glass piece is used which includes a protrusion fitting into the cavity. Cavities with widths of more than 10 micrometers are filled fast and reliably. The cavities may have inclined sidewalls.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.