Semiconductor device and manufacturing method thereof
US9219042B2 · kind B2 · utility
8Cited by
3References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 4, 2013 |
| Grant date | Dec 22, 2015 |
| Priority date | — |
| Expiry date | Feb 4, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided are a semiconductor device and a method of manufacturing the same. A carrier is removed after a first semiconductor die and a second semiconductor die are stacked on each other, and then a first encapsulant is formed, so that the carrier may be easily removed when compared to approaches in which a carrier is removed from a wafer having a thin thickness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.